Target materials, Sputtering targets

Target materials

Sputtering targets, Ionplating targets and evaporation materials

Various types of target and evaporation materials are available from Daido to meet your application, manufacturing method and required performance needs. We promise to provide you with high-quality target and evaporation materials meeting your requirements for high purity, uniform composition, high density and low gas content.

Main applications	Purity	Material
Magnet recording film	3N～4N	Ni	Co	Fe
		Ni-alloy	Co-alloy	Cr
		Cr-alloy
Display film	3N～4N	Cr	Mo	Ta
Display film	3N～4N	Ag-alloy
Semiconductor film, Electronic device film	3N～6N	Mo	Ta	W
Semiconductor film, Electronic device film	3N～6N	Ti	Ni
Magnet-Optical recording film	3N	Gd-Fe-Co	Tb-Fe-Co	Al-Ti
Magnet-Optical recording film	3N	Al-Cr	Al-V
Decorative film, Surface-hardening film	2N～3N	Ni-Cr-Mo	Zr	Hf
		Ti-Al	Ti-Al-V	Cr
		Ti
Resistor film	3N	Ni-Cr	Ni-V

Please feel free to consult us regarding requirements for materials, shapes, backing plate fabrication and bonding other than those shown above.

Product appearance

Plate
Width 50-300mm, Length300-3000mm

Disc
φ1～12inch/φ25～350㎜

Cylinder
Width 50-300mm, Length 500-2000mm

Evaporation materials
Example :φ50mm、10x10x10mm、φ13x10m

Original products

We develop original products that meet the needs of the market.
We can offer trial deposition using our sputtering machine and offer deposited samples.

NCT:Ni Alloy Sputtering Target for Protective Layer

Applications	Protective layer for Al or Cu wiring
Type	Sputtering target
Features	Excellent corrosion resistance and wet etchability As a protective film, it improves the corrosion resistance of Al or Cu wiring. Simultaneous etching of conductive layers and protective layer is possible using commercially available etchants. Product appearance Our Product Comparison material Deposition appearance after Humidity test
Example of use	Protect layer for touch panel wiring Cross section view of layers for touch panel Patterned sample （2μm at minimum Line width)

STARMESH^TM-α1:Sputtering Target for Blackening Layer

Applications	Blackening layer for Metal-mesh electrode-based touch panel
Type	Sputtering target
Features	Low reflectance and Good etchantability By stacking the blackening layer on Cu or Al wiring, the reflectance of the electrodes decreases. Simultaneous etching of conductive layers and Blackening layers is possible using commercially available etchants. Product appearance Patterned sample (3μm at minimum Line width) Reflectance
Example of use	Metal-mesh Electrode-based Touch Panel Cross section view of metal mesh electrode

[NEW]STARMESH^TM-β１:Sputtering Target for Blackening Layer

Applications	Blackening layer for Metal-mesh electrode-based touch panel
Type	Sputtering target
Features	Low reflectance & Excellent discoloration resistance By stacking the blackening layer on Cu or Al wiring, the reflectance of the electrodes decreases. In environmental tests assuming in-vehicle use, our blackening layer has no change in color or conductivity. Product appearance Reflectance Discoloration resistance
Example of use	Metal-mesh Electrode-based Touch Panel Cross section view of metal mesh electrode
introduction	NEWS　Development of the Sputtering Target "STARMESHTM-β1" for Blackening Layer with Excellent discoloration resistance