Target materials
Sputtering targets, Ionplating targets and evaporation materials

Various types of target and evaporation materials are available from Daido to meet your application, manufacturing method and required performance needs. We promise to provide you with high-quality target and evaporation materials meeting your requirements for high purity, uniform composition, high density and low gas content.
Main applications | Purity | Material | ||
---|---|---|---|---|
Magnet recording film | 3N~4N | Ni | Co | Fe |
Ni-alloy | Co-alloy | Cr | ||
Cr-alloy | ||||
Display film | 3N~4N | Cr | Mo | Ta |
Ag-alloy | ||||
Semiconductor film, Electronic device film |
3N~6N | Mo | Ta | W |
Ti | Ni | |||
Magnet-Optical recording film |
3N | Gd-Fe-Co | Tb-Fe-Co | Al-Ti |
Al-Cr | Al-V | |||
Decorative film, Surface-hardening film |
2N~3N | Ni-Cr-Mo | Zr | Hf |
Ti-Al | Ti-Al-V | Cr | ||
Ti | ||||
Resistor film | 3N | Ni-Cr | Ni-V |
- Please feel free to consult us regarding requirements for materials, shapes, backing plate fabrication and bonding other than those shown above.
Product appearance

Width 50-300mm, Length300-3000mm

φ1~12inch/φ25~350㎜

Width 50-300mm, Length 500-2000mm

Example :φ50mm、10x10x10mm、φ13x10m
Original products
We develop original products that meet the needs of the market.
We can offer trial deposition using our sputtering machine and offer deposited samples.
NCT:Ni Alloy Sputtering Target for Protective Layer
Applications | Protective layer for Al or Cu wiring |
Type | Sputtering target |
Features |
Excellent corrosion resistance and wet etchability As a protective film, it improves the corrosion resistance of Al or Cu wiring. Simultaneous etching of conductive layers and protective layer is possible using commercially available etchants. ![]() Product appearance Our Product ![]() Comparison material ![]() Deposition appearance after Humidity test |
Example of use |
Protect layer for touch panel wiring ![]() Cross section view of layers for touch panel
![]() Patterned sample
(2μm at minimum Line width) |
STARMESHTM-α1:Sputtering Target for Blackening Layer
Applications | Blackening layer for Metal-mesh electrode-based touch panel |
Type | Sputtering target |
Features |
Low reflectance and Good etchantability By stacking the blackening layer on Cu or Al wiring, the reflectance of the electrodes decreases. ![]() Product appearance
![]() Patterned sample
(3μm at minimum Line width) ![]() Reflectance
|
Example of use |
Metal-mesh Electrode-based Touch Panel ![]() ![]() Cross section view of metal mesh electrode
|
[NEW]STARMESHTM-β1:Sputtering Target for Blackening Layer
Applications | Blackening layer for Metal-mesh electrode-based touch panel |
Type | Sputtering target |
Features |
Low reflectance & Excellent discoloration resistance By stacking the blackening layer on Cu or Al wiring, the reflectance of the electrodes decreases. ![]() Product appearance
![]() Reflectance
![]() Discoloration resistance
|
Example of use |
Metal-mesh Electrode-based Touch Panel ![]() ![]() Cross section view of metal mesh electrode
|
introduction | NEWS Development of the Sputtering Target "STARMESHTM-β1" for Blackening Layer with Excellent discoloration resistance |