Target materials, Sputtering targets

Target materials, Sputtering targets

Thin-film Deposition/Coating & Electronic Materials

In addition to our diverse product line, we can meet your needs for original specifications. Various types of target and evaporation materials are available from Daido to meet your application, manufacturing method and required performance needs. Providing advanced materials, we are serving you in various fields.

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Target materials

Sputtering targets, Ionplating targets and evaporation materials

Sputtering targets, Ionplating targets and evaporation materials

Various types of target and evaporation materials are available from Daido to meet your application, manufacturing method and required performance needs. We promise to provide you with high-quality target and evaporation materials meeting your requirements for high purity, uniform composition, high density and low gas content.

Main applications Purity Material
Magnet recording film 3N~4N Ni Co Fe
Ni-alloy Co-alloy Cr
Cr-alloy
Display film 3N~4N Cr Mo Ta
Ag-alloy
Semiconductor film,
Electronic device film
3N~6N Mo Ta W
Ti Ni
Magnet-Optical
recording film
3N Gd-Fe-Co Tb-Fe-Co Al-Ti
Al-Cr Al-V
Decorative film,
Surface-hardening film
2N~3N Ni-Cr-Mo Zr Hf
Ti-Al Ti-Al-V Cr
Ti
Resistor film 3N Ni-Cr Ni-V
  • Please feel free to consult us regarding requirements for materials, shapes, backing plate fabrication and bonding other than those shown above.

Product appearance

Plate
Plate
Width 50-300mm, Length300-3000mm
Disc
Disc
φ1~12inch/φ25~350㎜
Cylinder
Cylinder
Width 50-300mm, Length 500-2000mm
Evaporation materials
Evaporation materials
Example :φ50mm、10x10x10mm、φ13x10m

Original products

We develop original products that meet the needs of the market.
We can offer trial deposition using our sputtering machine and offer deposited samples.

NCT:Ni Alloy Sputtering Target for Protective Layer

Applications Protective layer for Al or Cu wiring
Type Sputtering target
Features

Excellent corrosion resistance and wet etchability

As a protective film, it improves the corrosion resistance of Al or Cu wiring. Simultaneous etching of conductive layers and protective layer is possible using commercially available etchants.


Product appearance

Product appearance

Our Product

Our Product

Comparison material

Comparison material

Deposition appearance after Humidity test

Example
of use

Protect layer for touch panel wiring

Cross section view of layers for touch panel
Patterned sample
(2μm at minimum Line width)

STARMESHTM-α1:Sputtering Target for Blackening Layer

Applications Blackening layer for Metal-mesh electrode-based touch panel
Type Sputtering target
Features

Low reflectance and Good etchantability

By stacking the blackening layer on Cu or Al wiring, the reflectance of the electrodes decreases.
Simultaneous etching of conductive layers and Blackening layers is possible using commercially available etchants.

Product appearance
Product appearance
Patterned sample(3μm at minimum Line width)
Patterned sample
(3μm at minimum Line width)
Reflectance
Reflectance
Example
of use

Metal-mesh Electrode-based Touch Panel

Cross section view of metal mesh electrode

[NEW]STARMESHTM-β1:Sputtering Target for Blackening Layer

Applications Blackening layer for Metal-mesh electrode-based touch panel
Type Sputtering target
Features

Low reflectance & Excellent discoloration resistance

By stacking the blackening layer on Cu or Al wiring, the reflectance of the electrodes decreases.
In environmental tests assuming in-vehicle use, our blackening layer has no change in color or conductivity.

Product appearance
Product appearance
Reflectance
Reflectance
Discoloration resistance
Discoloration resistance
Example
of use

Metal-mesh Electrode-based Touch Panel

Cross section view of metal mesh electrode
introduction NEWS Development of the Sputtering Target "STARMESHTM-β1" for Blackening Layer with Excellent discoloration resistance

Inquiries about Target material, New metal