Welding Wire
Materials for Semiconductor Manufacturing Equipment
Font Size

Materials for Semiconductor Manufacturing Equipment:CLEANSTAR® Series

Features, Lineup, and Chemical Composition

These materials have high cleanliness within the chemical composition range of JIS SUS316L.
We offer three types in our lineup: CLEANSTAR-A, CLEANSTAR-B, and CLEANSTAR-C, each characterized by differences in manufacturing methods, composition, and cost.
They also comply with SUS316L standards (SEMI F20) as defined by the international SEMI standards for semiconductor manufacturing equipment.

  Melting Process Examples of Main Chemical Composition (mass%)
C Mn S Ni Cr Mo
JISG4303
SUS316L
-
0.030

2.00

0.030
12.00~
15.00
16.00~
18.00
2.00~
3.00
General 316L EAF,AOD 0.015 1.84 0.017 12.1 16.7 2.02
CLEANSTAR-A VIM-VAR 0.006 Ultra-Low Ultra-Low 14.7 16.7 2.23
CLEANSTAR-B EAF,AOD-VAR 0.007 Low Ultra-Low 14.7 16.7 2.23
CLEANSTAR-C EAF,AOD 0.012 Low Low 12.1 16.7 2.02

CLEANSTAR-A suppresses the generation of [Mn] fumes during welding by reducing [Mn] to extremely low levels, while achieving ultra high cleanliness through extremely low [S] content and special melting processes.
CLEANSTAR-B achieves ultra-high cleanliness through extremely low [S] content and special melting processes, providing a cost advantage when extremely low [Mn] levels are not required.
CLEANSTAR-C is air melted, but it achieves higher cleanliness compared to general 316L.

Cleanliness (example – the test results of nonmetallic inclusion)

Note:The following results are representative values, not guaranteed values.

ASTM E45 A B C D
Thin Heavy Thin Heavy Thin Heavy Thin Heavy
General 316L 2.5 1.5 1.0 0 1.0 1.0 1.5 0.5
CLEANSTAR-A 0 0 0 0 0 0 0.5 0
CLEANSTAR-B 0 0 0.5 0 1.0 1.0 1.0 0
CLEANSTAR-C 0 0 0.5 0 1.0 1.0 1.5 0.5

Corrosion Resistance

General Corrosion (Comparison of Corrosion Weight Loss)

Note:The following results are representative values, not guaranteed values.

General Corrosion graph
  • Method:Immersion test
  • Solution:1% HCl aq.
  • Temp:298K
  • Time:6 hrs

Pitting Corrosion (Comparison of Corrosion Weight Loss)

Note:The following results are representative values, not guaranteed values.

Pitting Corrosion graph
  • Method:Immersion test (ASTM G48-A)
  • Solution:Ferric Chloride aq.
  • Temp:308K
  • Time:24 hrs

CPT:Critical Pitting Temperature

Note:The following results are representative values, not guaranteed values.

CPT graph

EP (Electropolishing) and Passivation Quality

Note:The following results are representative values, not guaranteed values.

Standard Process Item SEMI F19 CLEANSTAR General
SUS316L
HP
Grade
UHP
Grade
A B C
SEMI F37 After EP Surface
Roughness
Ra Ave. (μin) ≦10 ≦5 1.2 1.2 1.2 1.2
Ra Max. (μin) ≦15 ≦10 1.2 1.2 1.2 1.2
Ry Max. (μin) ≦150 ≦100 6.7 7.5 7.9 9.4
SEMI F60 After
Passivation
Surface
Composition
Cr/Fe ≧1.0 ≧1.5 1.8 2.0 1.8 1.9
CrOx/FeOx ≧1.0 ≧2.0 3.0 3.3 2.9 2.9
SEMI F73 Surface
Defect
Average ≦30 ≦10 1 1 7 11
Max ≦50 ≦20 8 7 13 22

Inquiries about Material for Semiconductor Manufacturing Equipment

[CLEANSTAR®]

[Heat-Resistant Alloys, Corrosion-Resistant Alloys,
Titanium Alloys, Soft Magnetic Materials, Thermal Expansion Alloys]

[Materials for Bellows]