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Materials for Semiconductor Manufacturing Equipment:Low Thermal Expansion Alloys
Map of Representative Typical Low Thermal Expansion Materials
Lineup
Metals used for bonding with glass or ceramics must have a coefficient of thermal expansion similar to that of the glass or ceramic. Therefore, lower thermal expansion than that of conventional steels is required.
| Alloy | UNS | Common name |
Examples of Applicable Components (※) |
Available Products | Specifications | |||
|---|---|---|---|---|---|---|---|---|
| Bar | Wire rod | Strip | ASTM | JIS | ||||
| DF16CN | K94610 | kovar | Various Manufacturing and Inspection Equipment | ◎ | ◎ | ◎ | F15 | - |
| DF42N | K94100 | - | Various Manufacturing and Inspection Equipment | ○ | ◎ | ◎ | F30 | - |
| DF52N | - | - | Various Manufacturing and Inspection Equipment | ○ | ◎ | ○ | F30 | - |
| MENPD | K93610 K93600 |
invar | Various Manufacturing and Inspection Equipment | ○ | ◎ | ◎ | F1684 | - |
| MENPDS | - | super invar | Various Manufacturing and Inspection Equipment | ○ | ◎ | - | F1684 | - |
| DSALOY365 | - | - | Various Manufacturing and Inspection Equipment | ○ | ○ | ○ | - | - |
- ※Examples of applicable materials are excerpted from the implementation examples.
- ※For detailed information on possible manufacturing shapes, please contact us individually.
◎：Standard 〇：Available -：Not Available - ※Kovar is a registered trademark of Carpenter Technology Corporation.
- ※Invar is a registered trademark of Aperam Imphy Alloys
Chemical Composition・ Characteristics
| Alloy | JIS | Common name |
Nominal Chemical Composition (wt%) | thermal expansion coefficient (μm/m・℃) |
|||||
|---|---|---|---|---|---|---|---|---|---|
| C | Si | Mn | Ni | Co | Fe | ||||
| DF16CN | - | kovar | ≦0.04 | ≦0.20 | ≦0.50 | 29 | 17 | Bal. | 4.6～5.2 (30～400℃) 5.1～5.5 (30～450℃) |
| DF42N | - | - | ≦0.05 | ≦0.30 | ≦0.80 | 41 | - | Bal. | 4.0～4.7 (30～300℃) 6.7～7.4 (30～450℃) |
| DF52N | - | - | ≦0.05 | ≦0.30 | ≦0.60 | 50.5 | - | Bal. | 9.7～10.2 (30～450℃) 10.0～10.5 (30～550℃) |
| MENPD | - | invar | - | - | - | 36 | - | Bal. | 1.0～2.0 (30～100℃) |
| MENPDS | - | super invar | - | - | - | 32 | 4 | Bal. | ≦1.0 (30～100℃) |
| DSALOY365 | - | - | ≦0.05 | ≦0.60 | ≦1.0 | 43 | ≦2.0 | Bal. | 4.0～4.8 (30～100℃) |
- ※Kovar is a registered trademark of Carpenter Technology Corporation.
- ※Invar is a registered trademark of Aperam Imphy Alloys
| Alloy | General Characteristics of Alloys |
|---|---|
| DF16CN | Because its coefficient of thermal expansion up to the transformation point is close to that of borosilicate glass and alumina ceramics, it helps prevent thermal cracking during sealing. |
| DF42N | It exhibits low and stable thermal expansion from room temperature up to approximately 350℃, making it widely used for sealing with various types of glass. It is also used as Dumet wire when coated with copper. |
| DF52N | Its coefficient of thermal expansion is higher than that of DF42N and remains nearly constant up to approximately 450℃. It is used for sealing with soft glass, particularly in reed switch applications. |
| MENPD | It exhibits an extremely low coefficient of thermal expansion from cryogenic temperatures up to approximately 200℃, along with high volume resistivity and excellent high-frequency characteristics. |
| MENPDS | This is a low-expansion alloy in which part of the Ni in MENPD is substituted with Co, resulting in a further reduction of the coefficient of thermal expansion near room temperature, along with a slight improvement in strength. |
| DSALOY365 | It is a low thermal expansion alloy that achieves high strength through aging treatment. |
Low Thermal Expansion Materials Manufacturing Process of Forged Products
Characteristics of Forged Products (Compared to Cast Products):
- Enables the production of high-strength components
- Hot working and heat treatment promote recrystallization, resulting in grain refinement and uniform microstructure
